Front End

• Epitaxy
• Analytics
• Wet Chemistry
• Lithography
• Metallization (sputtering/evaporation)
• Etching
• Grinding
• Separation/Sawing
• Photoresist Plasma Ashing
• Testing
• Abatement and Pumps-
• Ovens

Back End

• Die Bonding
• Wire Bonding
• Die Sorting
• Curing (Oven)
• Vision Systems (Quality Control)
• Separation/Sawing
• Laser Deflashing
• Dispensing/Casting
• Measurement Systems (spectrometers, testers)
• Testhandler
• Molding (encapsulation)
• Trim & Form
• Plasma Cleaning
• Stencil Printer
• Reflow Soldering
• Laser Marking
• Buffer Linking